其他設備
Disco DAD321 切割機
Specifications
| Remark | : | The Disco DAD321 is an easy-to-use automatic / semi-automatic dicing saw capable of cutting wafers using a high-output air spindle with a diamond blade attached. |
|---|---|---|
| Main Dimensions(mm) | : | 500 x 1050 x 1455 |
| Substrate Size | : | 4" silicon full wafer |
| Wafer Thickness | : | 525µm |
| Blue Tape Thickness | : | 70µm |
| Blade OD | : | 2" |
| Blade Thickness | : | 27.5±2.5µm |
| Max Blade Speed | : | 30,000rpm |
| Max Feed Speed | : | 2mm/s |
| X-axis resolution | : | 1µm |
| Y-axis resolution | : | 0.2µm |
| Z-axis resolution | : | 0.1µm |